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Chinese Journal of Lasers, Volume. 40, Issue 10, 1002006(2013)

Precise Thermal Simulation Module for DFB Laser Sub-Assembly with Transistor Outline Package

Hou Xiaoke1,2、*, Zhang Liqing2, Zhang Shengli2, Wang Lei2, and Yao Yong1
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    Article index updated: Mar. 10, 2025

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    Hou Xiaoke, Zhang Liqing, Zhang Shengli, Wang Lei, Yao Yong. Precise Thermal Simulation Module for DFB Laser Sub-Assembly with Transistor Outline Package[J]. Chinese Journal of Lasers, 2013, 40(10): 1002006

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    Paper Information

    Category: Laser physics

    Received: Mar. 14, 2013

    Accepted: --

    Published Online: Sep. 25, 2013

    The Author Email: Xiaoke Hou (xiaoke_hou@aliyun.com)

    DOI:10.3788/cjl201340.1002006

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology