[1] [1] Gherarid N, Martin S, Massines F. J. Phys. D: Appl. Phys., 2000, 33: 104.

[2] [2] Stefanovic I, Bibinov N K, Deryugin A A, et al. Plasma Sources Sci. & Technol., 2001, 10: 406.

[3] [3] Laroussi M, Alexeff I, Kang W L. IEEE Trans. Plasma Sci., 2000, 28: 184.

[4] [4] Lloyd G, Friedman G, Jafri S, et al. Plasma Process. Polym., 2010, 7: 194.

[5] [5] Laroussi M. IEEE Trans. Plasma Sci., 2009, 37: 714.

[6] [6] Ehlbeck J, Schnabel U, Polak M, et al. J. Phys. D: Appl. Phys., 2011, 44: 013002.

[7] [7] Vidmar R J. IEEE Trans. on Plasma Sci., 1990, 18: 733.

[8] [8] Walsh J L, Kong M G. Appl. Phys. Lett., 2008, 93: 111501.

[9] [9] Prevosto L, Kelly H, Mancinelli B R. Journal of Applied Physics, 2012, 112: 063302.

[10] [10] Walsh J L, Shi J J, Kong M G. Appl. Phys. Lett., 2006, 88: 171501.

[11] [11] Lu X P, Xiong Z, Zhao F, et al. Appl. Phys. Lett., 2009, 95: 181501.

[12] [12] Stoffels E, Kieft I E, Sladek R E J, et al. Plasma Sources Sci. & Technol., 2006, 15: S169.

[13] [13] Hofmann S, Gessel A F H van, Verreycken T, et al. Plasma Sources Sci. Technol., 2011, 20: 065010.

[14] [14] Li X C, Jia P Y, Yuan N, et al. Phys. Plasmas, 2011, 18: 043505.