Chinese Optics Letters, Volume. 23, Issue 4, 041402(2025)

Flip-chip bonded 8-channel DFB laser array with highly uniform 400 GHz spacing and high output power for optical I/O technology

Jie Zhao1... Zhenxing Sun1,*, Pan Dai1,**, Jin Zhang2, Yanqiu Xu2, Yue Zhang1, Zhuoying Wang1, Jiaqiang Nie1, Wenxuan Wang3, Rulei Xiao1 and Xiangfei Chen1 |Show fewer author(s)
Author Affiliations
  • 1Key Laboratory of Intelligent Optical Sensing and Manipulation of the Ministry of Education & National Laboratory of Solid State Microstructures & College of Engineering and Applied Sciences & Institute of Optical Communication Engineering & Nanjing University-Tongding Joint Lab for Large-Scale Photonic Integrated Circuits, Nanjing University, Nanjing 210023, China
  • 2Nanjing Branch, China United Network Communications Corporation Limited, Nanjing 210002, China
  • 3Ocean College, Jiangsu University of Science and Technology, Zhenjiang 212003, China
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    References(19)

    [1] Y. Shan, W. Lin, Z. Guo. Towards a fully disaggregated and programmable data center. 13th ACM SIGOPS Asia-Pacific Workshop on Systems (APSys), 18-28(2022).

    [2] P. Grani, R. Proietti, V. Akella et al. Photonic interconnects for interposer-based 2.5D/3D integrated systems on a chip. International Symposium on Memory Systems (MEMSYS), 377-386(2016).

    [4] M. N. Sysak, R. Roucka, N. Aggarwal et al. Multi-wavelength sources for Optical IO Co-packaged optics. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1-3(2024).

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    Jie Zhao, Zhenxing Sun, Pan Dai, Jin Zhang, Yanqiu Xu, Yue Zhang, Zhuoying Wang, Jiaqiang Nie, Wenxuan Wang, Rulei Xiao, Xiangfei Chen, "Flip-chip bonded 8-channel DFB laser array with highly uniform 400 GHz spacing and high output power for optical I/O technology," Chin. Opt. Lett. 23, 041402 (2025)

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    Paper Information

    Category: Lasers, Optical Amplifiers, and Laser Optics

    Received: Sep. 13, 2024

    Accepted: Oct. 30, 2024

    Published Online: Apr. 11, 2025

    The Author Email: Zhenxing Sun (sunzhenxing@nju.edu.cn), Pan Dai (pdai@nju.edu.cn)

    DOI:10.3788/COL202523.041402

    CSTR:32184.14.COL202523.041402

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