Fig. 1. Structural diagram of infrared scene projector chip

Fig. 2. Principle block diagram of spatial resolution measurement

Fig. 3. Temperature distribution in chip plane

Fig. 4. Temperature gradient in y-direction

Fig. 5. Temperature distribution calculation model of MEMS chip with periodical microstructure

Fig. 6. Distribution of radiation intensity along x-direction

Fig. 7. Process diagram of MTF curve calculation

Fig. 8. Schematic of microstructure used for contact area ratio analysis. (a) 2D diagram of microstructure; (b) 3D diagram of microstructure

Fig. 9. Thermal radiation intensity distributions along x-direction of chips with different contact area ratios

Fig. 10. MTF curves of microstructured chips with different contact area ratios

Fig. 11. Schematic of microstructure used for filling factor analysis

Fig. 12. Thermal radiation intensity distributions of microstructured chips with different filling factors

Fig. 13. MTF curves of microstructured chips with different filling factors

Fig. 14. In-plane microstructures of infrared scene projector chips. (a) Contact area ratio of 0.20; (b) contact area ratio of 0.46

Fig. 15. Sample photo of infrared scene projector chip

Fig. 16. Microscope images of periodical microstructure. (a) Contact area ratio of 0.2; (b) contact area ratio of 0.46

Fig. 17. Experimental device diagram of spatial resolution measurement

Fig. 18. Measurement results obtained by infrared thermal imager. (a) Thermal radiation intensity distribution on chip surface; (b) temperature distribution along x-direction

Fig. 19. Radiation intensity distribution curves along x-axis of two chip samples

Fig. 20. MTF curves of two infrared scene projector chip samples