Low temperature co-fired ceramic (LTCC) has become the mainstream method for the high-density integration of electronic components. In order to meet the requirements of miniaturization and high-performance system applications, as the substrate support material, LTCC green tapes must ensure high quality and consistency. Additionally, in order to maintain accurate alignment of different layers, it is necessary to strictly control the shrinkage behavior of the green tape during sintering. The main factors affecting the shrinkage rate of LTCC green tapes from both material and process perspectives were summarized, including the particle size and morphology of inorganic powder, softening point of glass, the proportion of binder and plasticizers, casting speed, pressure of heat pressed laminations, and sintering curve. The sintering process and the reasons for shrinkage of green tapes were analyzed, and the impact of each factors and control methods on the quality of green tapes were discussed，providing reference for the preparation of high-quality green tapes.