Journal of Semiconductors, Volume. 42, Issue 9, 092802(2021)
Effect of the post-gate annealing on the gate reliability of AlGaN/GaN HEMTs
Fig. 1. (Color online) The cross-section schematic of the AlGaN/GaN HEMT.
Fig. 2. (Color online) Reverse
Fig. 3. (Color online) (a) The gate capacitance versus
Fig. 4. (Color online) The ln (
Fig. 5. (Color online) Gate leakage measured during the reverse gate-bias step stress of (a) unannealed HEMT, (b) annealed HEMT. Inset: absolute value of reverse gate-bias step stress versus times (
Fig. 6. (Color online) Gate leakage current before and after reverse bias step stress of (a) unannealed HEMT, (b) annealed HEMT, (c) maximum output currents, and (d) transfer characteristics before and after reverse bias step stress of the unannealed HEMT.
Fig. 7. (Color online) Schematic of the gate leakage at reverse gate bias before the stress of (a) unannealed HEMT, (b) annealed HEMT.
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Changxi Chen, Quan Wang, Wei Li, Qian Wang, Chun Feng, Lijuan Jiang, Hongling Xiao, Xiaoliang Wang. Effect of the post-gate annealing on the gate reliability of AlGaN/GaN HEMTs[J]. Journal of Semiconductors, 2021, 42(9): 092802
Category: Articles
Received: Apr. 1, 2021
Accepted: --
Published Online: Sep. 15, 2021
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