Optoelectronic Technology, Volume. 42, Issue 1, 57(2022)

Cutting Wave Defect Improvement with the Scribing Procedure

Feigao WU, Qinqi LIU, Hairong WANG, Fuqing LIU, Ciguang LUO, and Minghui LIU
Author Affiliations
  • HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY Co.,Ltd., MDL Engineering Dept., Hefei 230012, CHN
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    Figures & Tables(11)
    Path of the wave defect and statistics of the wave defect
    Scribing pressure and wave defect
    Image of mirror radius
    Contrast of wave defect and glass strength
    Defects mapping
    Hackle mark and broken point
    Rib Mark miss
    New scribing lines
    The relationship between Pick up direction and Broken
    Pick up force analysis
    • Table 1. Stage flatness measurements

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      Table 1. Stage flatness measurements

      0°方向/μm90°方向/μm
      12341234
      流片方向14-18-21-2113-10-16-4
      -5-23-20-21-13-27-41-22
      -6-28-44-37-31-43-48-22
      最大偏差58 μm61 μm
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    Feigao WU, Qinqi LIU, Hairong WANG, Fuqing LIU, Ciguang LUO, Minghui LIU. Cutting Wave Defect Improvement with the Scribing Procedure[J]. Optoelectronic Technology, 2022, 42(1): 57

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    Paper Information

    Category: Research and Trial-manufacture

    Received: Aug. 9, 2021

    Accepted: --

    Published Online: Aug. 3, 2022

    The Author Email:

    DOI:10.19453/j.cnki.1005-488x.2022.01.012

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