Cutting Wave Defect Improvement with the Scribing Procedure

Feigao WU; Qinqi LIU; Hairong WANG; Fuqing LIU; Ciguang LUO; Minghui LIU

doi:10.19453/j.cnki.1005-488x.2022.01.012

Optoelectronic Technology, Volume. 42, Issue 1, 57(2022)

Cutting Wave Defect Improvement with the Scribing Procedure

Feigao WU, Qinqi LIU, Hairong WANG, Fuqing LIU, Ciguang LUO, and Minghui LIU

Author Affiliations

HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY Co.,Ltd., MDL Engineering Dept., Hefei 230012, CHN

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By testing different DOE conditions of cutting process， and based on the characteristics of automatic cutting machine， the same cutter process with high repeated accuracy and the auxiliary cutting process with the same wheel were used.

Keywords

defect improvement LCD glass scribing process TFT-LCD wheel

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Feigao WU, Qinqi LIU, Hairong WANG, Fuqing LIU, Ciguang LUO, Minghui LIU. Cutting Wave Defect Improvement with the Scribing Procedure[J]. Optoelectronic Technology, 2022, 42(1): 57

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Paper Information

Category: Research and Trial-manufacture

Received: Aug. 9, 2021

Accepted: --

Published Online: Aug. 3, 2022

The Author Email:

DOI:10.19453/j.cnki.1005-488x.2022.01.012

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology