Piezoelectrics & Acoustooptics, Volume. 46, Issue 2, 202(2024)

Design and Simulation of a Low-Temperature Sensitive Resonant Pressure Sensor

LI Guangxian1,2, HUANG Jing1,2,3, YUAN Yupeng1,2,3, YANG Jing1,2,3, LI Chunyang1,2, ZHANG Zuwei1,2,3, and LONG Shuai1,2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    References(13)

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    [4] [4] YANG Min, CHEN Fubin,ZHU Jialin, et al. Low temperature drift structure design and temperature compensation of quartz resonant accelerometer[J].Piezoelectrics & Acoustooptics,2023,45(5):719-722.

    [5] [5] WANG Yinxin, WANG Lu, LI Jun, et al. Calibration and compensation algorithms for intracranial temperature and pressure sensors[J].Piezoelectrics & Acoustooptics,2019,41(6):856-860.

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    [7] [7] MELAMUD R, CHANDORKAR S A, KIM B, et al. Temperature-compensated high-stability silicon resonators[J].Appl Phys Lett,2007,90(24):244107(1-3).

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    [9] [9] GUO Xinrong, ZHANG Yongwei, TAN Qiulin. Design and simulation of a novel SAW triaxial acceleration sensor[J].Piezoelectrics & Acoustooptics,2020,42(5):644-648.

    [10] [10] YUE Huhu, PENG Bin, LI Ling, et al. Design of temperature sensor based on double SAW resonator[J].Piezoelectrics & Acoustooptics,2021,43(1):1-4.

    [12] [12] LU Yulan, XIE Bo, LI Chuanhao, et al. An oil-filled MEMS resonant pressure sensor based on electrostatic stiffness modulation[J].IEEE Electron Device Letters,2023,44(12):2027-2030

    [13] [13] ZHAO Libo, HAN Xiangguang, MAO Qi, et al. Temperature-insensitive silicon resonant pressure sensor by thermal stress control[J].Sensors and Actuators A:Physical,2021,322:112612.

    [15] [15] LI Yuxin, CHEN Deyong, WANG Junbo. Stress isolation used In MEMS resonant pressure sensor package[J].Procedia Engineering,2011,25:455-458.

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    LI Guangxian, HUANG Jing, YUAN Yupeng, YANG Jing, LI Chunyang, ZHANG Zuwei, LONG Shuai. Design and Simulation of a Low-Temperature Sensitive Resonant Pressure Sensor[J]. Piezoelectrics & Acoustooptics, 2024, 46(2): 202

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    Paper Information

    Received: Jan. 3, 2024

    Accepted: --

    Published Online: Aug. 29, 2024

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2024.02.012

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