Journal of Semiconductors, Volume. 42, Issue 1, 013102(2021)

A review of in situ transmission electron microscopy study on the switching mechanism and packaging reliability in non-volatile memory

Xin Yang1, Chen Luo1, Xiyue Tian1, Fang Liang1, Yin Xia1, Xinqian Chen1, Chaolun Wang1, Steve Xin Liang2, Xing Wu1, and Junhao Chu1
Author Affiliations
  • 1Shanghai Key Laboratory of Multidimensional Information Processing, East China Normal University, Shanghai 200241, China
  • 2Changjiang Electronics Integrated Circuit (Shaoxing) Co., Ltd, Shaoxing 312000, China
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    Xin Yang, Chen Luo, Xiyue Tian, Fang Liang, Yin Xia, Xinqian Chen, Chaolun Wang, Steve Xin Liang, Xing Wu, Junhao Chu. A review of in situ transmission electron microscopy study on the switching mechanism and packaging reliability in non-volatile memory[J]. Journal of Semiconductors, 2021, 42(1): 013102

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    Paper Information

    Category: Reviews

    Received: Apr. 26, 2020

    Accepted: --

    Published Online: Mar. 19, 2021

    The Author Email:

    DOI:10.1088/1674-4926/42/1/013102

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