APPLIED LASER, Volume. 41, Issue 3, 556(2021)

Three-dimensional Measurement of QFP Chip Pins Based on Point Cloud Processing

Liang Tianwei1、*, Zhu Chengxiang1, and Chen Hao2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(3)

    [2] [2] ZHONG Q S, CHEN Z, ZHANG X M, et al. Feature-based object location of IC pins by using fast Run length encoding BLOB analysis[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(11): 1887-1898.

    [3] [3] KAITWANIDVILAI S. Pattern recognition technique for integrated circuit (IC) pins inspection using wavelet transform with chain-code-discrete Fourier transform and signal correlation[J]. International Journal of the Physical Sciences, 2012, 7(9): 1326-1332.

    [5] [5] HAWARI Y, SALAMI M J E, ABURAS A A. Fuzzy based technique for microchip lead inspection using machine vision[C]//2008 International Conference on Computer and Communication Engineering. Piscataway: IEEE, 2008: 1222-1226.

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    Liang Tianwei, Zhu Chengxiang, Chen Hao. Three-dimensional Measurement of QFP Chip Pins Based on Point Cloud Processing[J]. APPLIED LASER, 2021, 41(3): 556

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    Paper Information

    Received: Mar. 7, 2021

    Accepted: --

    Published Online: Jan. 1, 2022

    The Author Email: Tianwei Liang (916190436@qq.com)

    DOI:10.14128/j.cnki.al.20214103.556

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