Chinese Journal of Lasers, Volume. 48, Issue 8, 0802008(2021)

Joining Process of Copper Nanoparticles with Femtosecond Laser Irradiation

Jianing Liao, Xinda Wang, Xinwen Zhou, Hui Kang, Wei Guo, and Peng Peng*
Author Affiliations
  • School of Mechanical Engineering & Automation, Beihang University, Beijing 100191, China
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    Figures & Tables(6)
    Copper microstructure sheet resistance change curve with laser power (inset: photograph of the LED circuit prepared from Cu microstructure)
    XRD pattern of copper microstructure prepared with different laser powers
    SEM images of copper microstructure obtained under different laser power(insets: high-resolution SEM images). (a) 322 mW; (b) 626 mW;(c) 960 mW; (d) 1240 mW; (e) 1690 mW;(f) 1880 mW
    HRTEM images of the copper microstructure obtained at 960 mW laser power. (a) Cu nanoparticles; (b) interfaces of Cu nanoparticles and Cu-C structure; (c) (d) interfaces of Cu-Cu2O nanoparticles
    COMSOL simulation results of femtosecond laser irradiation of a Cu nanoparticle dimer. (a) Schematic of the model geometry for a Cu nanoparticles dimer; (b) relative electric field enhancement (|E/E0|) distribution of the Cu nanoparticle dimer under 960 mW laser irradiation, where E is the calculated electric field intensity and E0 is the incident electric field intensity; (c)--(e) temperature field distribution of a Cu nanoparticle dimer under 322 mW, 960 mW, and 1690 mW single pulse laser irradiation after 5 ps, respectively
    Relationship between electron and lattice temperature of Cu nanoparticles in the first 5 ps under different laser powers of single pulse laser irradiation
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    Jianing Liao, Xinda Wang, Xinwen Zhou, Hui Kang, Wei Guo, Peng Peng. Joining Process of Copper Nanoparticles with Femtosecond Laser Irradiation[J]. Chinese Journal of Lasers, 2021, 48(8): 0802008

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    Paper Information

    Category: laser manufacturing

    Received: Dec. 1, 2020

    Accepted: Feb. 23, 2021

    Published Online: Mar. 31, 2021

    The Author Email: Peng Peng (ppeng@buaa.edu.cn)

    DOI:10.3788/CJL202148.0802008

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