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Laser & Optoelectronics Progress, Volume. 52, Issue 1, 11404(2015)

Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser

Chen Hua1、*, Xue Shoulong1,2, and Hu Hong2
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    Chen Hua, Xue Shoulong, Hu Hong. Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser[J]. Laser & Optoelectronics Progress, 2015, 52(1): 11404

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    Paper Information

    Category: Lasers and Laser Optics

    Received: Jun. 17, 2014

    Accepted: --

    Published Online: Jan. 4, 2015

    The Author Email: Chen Hua (rd@mingfengdg.com)

    DOI:10.3788/lop52.011404

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology