Chip
Editor-in-Chief
Jun-Fa Mao
CN
31-2189/O4
ISSN
2709-4723
Frequency
Quarterly issues
A versatile optoelectronic device for ultrasensitive negative-positive pressure sensing applicationsResearch Articles
Xiaoshuai An... and Kwai Hei Li|Show fewer author(s)
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100116
On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence charactersResearch Articles
Feifei Qin... and Gangyi Zhu|Show fewer author(s)
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100115
Silicon photonic integrated wideband radio frequency self-interference cancellation chip for over-the-air in-band full-duplex communicationResearch Articles
Xinxin Su... and Mingshan Zhao|Show fewer author(s)
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100114
III-nitride MQW-based optoelectronic sensors for multifunctional environmental monitoringResearch Articles
Xumin Gao... and Zheng Shi|Show fewer author(s)
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100113
Haiqi Gao... and Chenying Yang|Show fewer author(s)
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100112
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Challenges and recent advances in HfO2-based ferroelectric films for non-volatile memory applications
ChipVol. 3, Issue 3, 100101 (2024)
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View fulltextRemote electric powering by germanium photovoltaic conversion of an Erbium-fiber laser beam
ChipVol. 3, Issue 3, 100099 (2024)
Highly sensitive diamond X-ray detector array for high-temperature applications
ChipVol. 3, Issue 3, 100106 (2024)
Channel-bias-controlled reconfigurable silicon nanowire transistors via an asymmetric electrode contact strategy
ChipVol. 3, Issue 3, 100098 (2024)
Colloidal semiconductor nanocrystals for light emission and photonic integration
ChipVol. 3, Issue 1, 100073 (2024)
Measurement of cryoelectronics heating using a local quantum dot thermometer in silicon
ChipVol. 3, Issue 3, 100097 (2024)
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