Microelectronics, Volume. 52, Issue 6, 1081(2022)

Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition

SHI Hangbo1... LI Kui1, ZHOU Yubao1, ZHAO Chi1, GE Jianding1 and CAO Xin2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(3)

    [11] [11] SURENDAR A, SISWANTO W A, ALIJANI M, et al. High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages [J]. Microsyst Technol, 2019, 25(3): 4027-4034.

    [14] [14] LEE W W, NGUYEN L T, SELVADURAY G S. Solder joint fatigue models: review and applicability to chip scale packages [J]. Microelec Reliab, 2000, 40(2): 231-244.

    [15] [15] EKPU M, BHATTI R, OKEREKE M I, et al. Fatigue life of lead-free older thermal interface materials at varying bond line thickness in microelectronics [J]. Microelec Reliab, 2014, 54(1): 239-244.

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    SHI Hangbo, LI Kui, ZHOU Yubao, ZHAO Chi, GE Jianding, CAO Xin. Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition[J]. Microelectronics, 2022, 52(6): 1081

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    Paper Information

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    Received: Nov. 22, 2021

    Accepted: --

    Published Online: Mar. 11, 2023

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.210454

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