Microelectronics, Volume. 52, Issue 6, 1081(2022)
Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition
[11] [11] SURENDAR A, SISWANTO W A, ALIJANI M, et al. High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages [J]. Microsyst Technol, 2019, 25(3): 4027-4034.
[14] [14] LEE W W, NGUYEN L T, SELVADURAY G S. Solder joint fatigue models: review and applicability to chip scale packages [J]. Microelec Reliab, 2000, 40(2): 231-244.
[15] [15] EKPU M, BHATTI R, OKEREKE M I, et al. Fatigue life of lead-free older thermal interface materials at varying bond line thickness in microelectronics [J]. Microelec Reliab, 2014, 54(1): 239-244.
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SHI Hangbo, LI Kui, ZHOU Yubao, ZHAO Chi, GE Jianding, CAO Xin. Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition[J]. Microelectronics, 2022, 52(6): 1081
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Received: Nov. 22, 2021
Accepted: --
Published Online: Mar. 11, 2023
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