Microelectronics, Volume. 52, Issue 6, 1081(2022)
Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition
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SHI Hangbo, LI Kui, ZHOU Yubao, ZHAO Chi, GE Jianding, CAO Xin. Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition[J]. Microelectronics, 2022, 52(6): 1081
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Received: Nov. 22, 2021
Accepted: --
Published Online: Mar. 11, 2023
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