[1] S HOLMSTRÖM, U BARAN, H UREY. MEMS laser scanners: a review. Journal of Microelectromechanical Systems, 23, 259-275(2014).

[2] P KESSEL, L HORNBECK, R MEIER et al. A MEMS-based projection display. Proceedings of the IEEE, 86, 1687-1704(1998).

[3] Dingkang WANG, C WATKINS, Huikai XIE. MEMS mirrors for LiDAR: a review, micromachines. Micromachines, 11, 456-478(2020).

[4] K ITO, C NICLASS, I AOYAGI et al. System design and performance characterization of a MEMS-based laser scanning time-of-flight sensor based on a 256×64-pixel single-photon imager. IEEE Photonics Journal, 5, 6800114(2013).

[5] Jiahui HE, Peng ZHOU, Huijun YU et al. Research on large size mems scanning mirror driven by electromagnetic. Acta Photonica Sinica, 46, 0123003(2017).

[6] A TORTSCANOFF, A FRANK, M WILDENHAIN et al. Position encoding and phase control of resonant MOEMS mirrors. Sensors and Actuators A: Physical, 162, 235-240(2010).

[7] A HUNG, H LAI, Tawei LIN et al. An electrostatically driven 2D micro-scanning mirror with capacitive sensing for projection display. Sensors and Actuators A: Physical, 222, 122-129(2015).

[8] Hongjie LEI, Quan WEN, Fan YU et al. FR4-Based electromagnetic scanning micromirror integrated with angle sensor. Micromachines, 9, 214-222(2018).

[9] Huijun YU, Peng ZHOU, Kewei WANG et al. Optimization of MOEMS projection module performance with enhanced piezoresistive sensitivity. Micromachines, 11, 651-664(2020).

[10] Zhongye WU, Shangshu YANG, Guoqiang Wu. Low-stress packaging technology for MEMS devices. Micro/nano Electronics and Intelligent Manufacturing, 2, 43-51(2020).

[11] E SUHIR. Predicted thermal stresses in a bimaterial assembly adhesively bonded at the ends. Journal of Applied physics, 89, 120-129(2000).

[12] E YAMADA. A Bonded joint analysis for surface mount components. Journal of Electronic Packaging, 114, 1-7(1992).

[13] Yulan LU, Bo XIE, Qiuxu WEI et al. A resonant pressure microsensor with a stress isolation layer. IEEE Sensors Journal, 19, 7875-7883(2019).

[14] Yuming MO, Jie YANG, Bo PENG et al. Design and verification of a structure for isolating stress in sandwich MEMS accelerometer. Microsystem Technologie, 27, 1943-1950(2021).

[15] Yonggang YIN, Zhengxiang FANG, Yunfeng LIU et al. Temperature-insensitive structure design of micromachined resonant accelerometers. Sensors, 19, 1544(2019).

[16] H HSIEH, H CHANG, C HU et al. Method for performance improvement and size shrinkage of a three-axis piezoresistive accelerometer with guard-ring structure(2012).

[17] Y KANDA. A graphical representation of the piezoresistance coefficients in silicon. IEEE Transactions on Electron Devices, 29, 64-70(1982).

[18] W P MASON, R N THURSTON. Use of Piezoresistive materials in the measurement of displacement, force, and torque. The Journal of Acoustical Society of America, 29, 1096-1102(1957).

[19] Dazhong JIN. Micromechanical resonant cantilever sensors for bio/chemical detection(2006).