Acta Photonica Sinica, Volume. 51, Issue 5, 0551311(2022)
Novel Packaging Stress Isolation Structure for MEMS Micromirror with Piezoresistive Angle Sensor
Fig. 4. View of packaging of MEMS micromirror and micromirror in details
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Lei QIAN, Jie HU, Yameng SHAN, Junduo WANG, Peng ZHOU, Wenjiang SHEN. Novel Packaging Stress Isolation Structure for MEMS Micromirror with Piezoresistive Angle Sensor[J]. Acta Photonica Sinica, 2022, 51(5): 0551311
Category: Special Issue for Micro/Nanophotonics
Received: Feb. 21, 2022
Accepted: Apr. 25, 2022
Published Online: Jun. 28, 2022
The Author Email: SHEN Wenjiang (wjshen2011@sinano.ac.cn)