This paper expounds the current research and future development of Mass Transfer （MT） and Motion Positioning Platform （MPP） technology. On the basis of the chip transfer method， the MT scheme can be divided into precision pick-and-release， self-assembly， roller-transfer， and laser lift-off technology. The development process of the MT scheme is discussed based on the chip transfer efficiency and yield. On this basis， the structures and working principles of mechanical， air-supported， magnetic levitation， and hybrid configurations are introduced. Considering the aspects such as motion stroke and positioning accuracy， the advantages and disadvantages of MPPs are discussed. Finally， the development prospects of MT and MPP devices are predicted. Laser lift-off technology based on microporous liquid-gas bimodal media and hybrid-configuration MPP that combines mechanical and magnetic tracks with circumferential small-angle correction and axial micro-height-adjustment capabilities are expected to form the focus of the research on Mini/Micro LED chip-transfer technology.