Optics and Precision Engineering, Volume. 29, Issue 12, 2818(2021)

Research progress of microcapacitors: from preparation technology to development trend

Li XIONG1... Jin HU1, Zhao YANG2,3 and Guan-hua ZHANG1,* |Show fewer author(s)
Author Affiliations
  • 1National Engineering Research Center for High Efficiency Grinding,College of Mechanical and Vehicle Engineering, Hunan University, Changsha40082, China
  • 2Guangdong Fenghua Advanced Technology Holding Co., Ltd., Zhaoqing56060, China
  • 3State Key Laboratory of Advanced Material and Electronic Components, Zhaoqing526060, China
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    Figures & Tables(12)
    Ragone plots of microcapacitors and other energy storage devices[6]
    Production processes and schematic diagram of aluminum and tantalum electrolytic capacitors
    Production processes and schematic diagram of film capacitor and multilayer ceramic capacitor
    Schematic diagram of MIM and MIS capacitors
    Schematic diagram of 3D microcapacitors based on MIM and MIS structures
    Schematic diagram of electric double layer of supercapacitor under external electric field
    Schematic diagram of method for integrating micro-supercapacitors[36]
    Main preparation process of 3D silicon-based capacitors[23]
    Micromorphology and film thickness preparation of medium thin films[23]
    Graphene-based supercapacitors prepared on Si substrate and SiC substrate respectively[48-49]
    • Table 1. Comparison of electrode materials, electrolytes, main processing techniques and properties of micro-supercapacitors

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      Table 1. Comparison of electrode materials, electrolytes, main processing techniques and properties of micro-supercapacitors

      电极材料电解质主要工艺

      电容密度/

      (μF·cm-2

      能量密度功率密度
      多孔纳米硅37TEI-BF4ALD5×1031.3 mWh/cm32.14×105 mW/cm3
      硼掺杂多孔碳35H2SO43D干涉光刻7.1×1037.1 mWh/cm36.6×104 mW/cm3
      氢氧化镍28KOH化学浴沉积1.6×10421 mWh/cm3262.5 mW/cm3
      多孔硅/氮化钛32EMI-BF4电化学刻蚀+ALD+CVD3×1039 mWh/cm31×104 mW/cm3
      石墨烯38H2SO4/PVA氧等离子刻蚀80.72.5 mWh/cm34.95×105 mW/cm3
      石墨烯/聚苯胺39H2SO4/PVA氧等离子刻蚀3.31×1031.51 mWh/cm3-
      石墨烯27H2SO4/PVA激光录刻2×1032 mWh/cm32×105 mW/cm3
      石墨化碳30H2SO4反应离子刻蚀7430.025 μWh/cm21.5 µW/cm2
      碳化硅纳米线7KClLPCVD2400.019 μWh/cm24 µW/cm2
      硅纳米线26EMI-TFSI反应离子刻蚀310.059 μWh/cm20.472 µW/cm2
      活性炭/氧化钼34H3PO4/PVA丝网印刷5.04×1030.7 μWh/cm2-
      氧化石墨烯29KOH氧等离子刻蚀4×1020.04 μWh/cm296 µW/cm2
    • Table 2. Comparison of the main structure technologies and characteristics for solid microcapacitors in the literature

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      Table 2. Comparison of the main structure technologies and characteristics for solid microcapacitors in the literature

      结 构工 艺

      电容密度/

      (μF·cm-2

      漏电流/

      (A·cm-2

      击穿电压/V频率/Hz
      绝缘3D+MIM19AAO+ALD1005.9×10-9(2 V)2.6<100
      绝缘3D+MIM15ZnO NW+ALD4410×10-6(6 V)6104
      绝缘3D+MIM23DRIE+ALD100-167×104
      MIS18RIE+ED4.51.15×10-5(2 V)>8103
      绝缘3D+MIM36AAO+CVD47(15 V)2.28×10-8(15 V)15-
      绝缘3D+MIS16ICP+LPCVD2<5×10-9(-)70-
      MIM17MS0.177.65×10-7(60 V)40105
      绝缘3D+MIM21DRIE+ALD3.63×10-9(1 V)6.8105
      绝缘3D+MIM25DRIE+ALD0.5-204.5×107
      MIM20AAO+ALD100---
      绝缘3D+MIM22AAO+ALD26.24.3×10-10(-)--
      绝缘3D+MIM24DRIE+ALD444.0×10-11(-)25-
      MIM47RIE+ALD5<5×10-7(-)0.7-
      绝缘3D+MIS41RIE+ALD11-202×104
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    Li XIONG, Jin HU, Zhao YANG, Guan-hua ZHANG. Research progress of microcapacitors: from preparation technology to development trend[J]. Optics and Precision Engineering, 2021, 29(12): 2818

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    Paper Information

    Category: Micro/Nano Technology and Fine Mechanics

    Received: Jan. 5, 2021

    Accepted: --

    Published Online: Jan. 20, 2022

    The Author Email: ZHANG Guan-hua (guanhuazhang@hnu.edu.cn)

    DOI:10.37188/OPE.20212912.2818

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