Journal of the Chinese Ceramic Society, Volume. 49, Issue 12, 2644(2021)
Effects of Scratch Speed and Crystal Orientation on Scratch Characteristics of 6H-SiC Wafer
[4] [4] BIFANO T G, DOW T A, SCATTEGOOD R O. Ductile-regime grinding: a new technology for machining brittle materials [J]. J Eng Ind, 1991, 113(2): 184-189.
[5] [5] ONG N S, VENKATSH V C. Semi-ductile grinding and polishing of pyrex glass [J]. J Mater Process Technol, 1998, 83(1): 261-266.
[6] [6] SINHOFF V, KONIG W. Generative precision grinding of optical glass [J]. CIRP Annals, 1998, 47(1): 253-258.
[11] [11] HUANG P, ZHANG J. Strain rate effect on the ductile brittle transition in grinding hot pressed SiC ceramics [J]. Micromachines, 2020, 11(6): 1-15.
[12] [12] CODY, KUNKA, ALISON, et al. Interaction of indentation-induced cracks on single-crystal silicon carbide [J]. J Am Ceram Soc, 2015, 98(6): 1891-1897.
[15] [15] SYVAEJAERVI M, YAKIMOVA R, JANZEN E. Cross-sectional cleavages of SiC for evaluation of epitaxial layers [J]. J Cryst Growth, 2000, 208(1): 409-415.
[17] [17] PRASAD K E, RAMESH K T. Hardness and mechanical anisotropy of hexagonal SiC single crystal polytypes [J]. J Alloy Compd, 2019, 770: 158-165.
[18] [18] SADANAGA R, OHSUMI K, MATSUMOTO T. On the diffraction enhancement of symmetry in SiC [J]. Proc Jpn Acad, 1973, 49(10): 816-819.
[19] [19] PETRENKO T T, PETRENKO T L, VY BRATUS’, et al. Symmetry, spin state and hyperfine parameters of vacancies in cubic SiC [J]. Appl Surf Sci, 2001, 184(1): 273-277.
Get Citation
Copy Citation Text
ZHANG Yinxia, HUANG Pengju, GAO Wei. Effects of Scratch Speed and Crystal Orientation on Scratch Characteristics of 6H-SiC Wafer[J]. Journal of the Chinese Ceramic Society, 2021, 49(12): 2644
Category:
Received: Jan. 29, 2021
Accepted: --
Published Online: Feb. 11, 2022
The Author Email: Wei GAO (gaowei@zzu.edu.cn)
CSTR:32186.14.