Infrared and Laser Engineering, Volume. 51, Issue 5, 20210416(2022)

Laser marking process on transparent materials

Yinan Zhang1...2, Wen Sun1,2,*, Defeng Mo1,2, Qinfei Xu1,2, and Xue Li12 |Show fewer author(s)
Author Affiliations
  • 1Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 2Key Laboratory of Infrared Imaging Materials and Devices, Chinese Academy of Sciences, Shanghai 200083, China
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    References(8)

    [1] [1] Lawrence J. Advances in Laser Materials Processing[M]. Duxfd: Woodhead Publishing, 2018.

    [2] Hongjie Wang, Wengang Guo, Zhaohui Dong, et al. Application of laser etching technology. Infrared and Laser Engineering, 33, 469-472(2004).

    [3] Yanping Hu. Application of laser Internal carving technology in handicrafts. Mechanical Engineering & Automation, 3, 129-130, 135(2020).

    [4] Weijun Su, Yunzhe Liu, Qun Wang. Use of laser inside-carving machine and related problems solution. Journal of Beijing Technology and Business University(Natural Science Edition), 26, 25-27(2008).

    [5] Liang Chen, Xiaodong Liu, Jing Liu, et al. Microgroove etching with femtosecond laser on quartz glass surfaces. Acta Optica Sinica, 40, 2314001(2020).

    [6] Tianqing Jia, Hong Chen, Jue Wang, et al. Mechanism of laser-induced damage in fused silica. High Power Laser and Partical Beams, 10, 375-378(1998).

    [7] Wenfeng Zhang, Yunzhi Guo, Fei Yan, et al. Study on thermodynamics damage characteristics of sapphire from CW laser. Aero Weaponry, 52-55(2016).

    [8] Jianping Hu, Ping Ma, Qiao Xu. Laser damage threshold measurement of the optical elements. Infrared and Laser Engineering, 35, 187-191(2006).

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    Yinan Zhang, Wen Sun, Defeng Mo, Qinfei Xu, Xue Li. Laser marking process on transparent materials[J]. Infrared and Laser Engineering, 2022, 51(5): 20210416

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    Paper Information

    Category: Lasers & Laser optics

    Received: Jun. 21, 2021

    Accepted: --

    Published Online: Jun. 14, 2022

    The Author Email: Sun Wen (jacksunwen@mail.sitp.ac.cn)

    DOI:10.3788/IRLA20210416

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