Infrared and Laser Engineering, Volume. 51, Issue 5, 20210416(2022)

Laser marking process on transparent materials

Yinan Zhang1...2, Wen Sun1,2,*, Defeng Mo1,2, Qinfei Xu1,2, and Xue Li12 |Show fewer author(s)
Author Affiliations
  • 1Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 2Key Laboratory of Infrared Imaging Materials and Devices, Chinese Academy of Sciences, Shanghai 200083, China
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    Figures & Tables(11)
    Measured ln(Ep) versus D2 and fitting results
    Radial distribution of laser energy density based on fitting results
    Measured output spot diameter versus defocus distance of laser processing head
    Relative energy density versus defocus distance of output spot of laser processing head
    Effects of laser beam scanning angle of laser processing head on the geometry deviation of marking position
    Macro photo of laser marking on IR Conning glass at different focusing depths
    Photo of laser marking on the upper surface at relative laser power of 9% and 8% with one scan
    • Table 1. Laser parameters

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      Table 1. Laser parameters

      NameParametersRemarks
      Wavelength515 (Green) 1030 nm Yb: YAG doubling
      Average laser power/W151%-100% available
      Pulse width/ps<10Picosecond pulse
      Maximum single pulse energy/μJ 751%-100% available
      Range of repeat frequency/kHz200-400Set 200 kHz on this equipment
      Beam quality (M2) <1.3Gauss distribution
    • Table 2. Linos F-Theta-Ronar lens and galvanometer scanning parameters of laser processing

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      Table 2. Linos F-Theta-Ronar lens and galvanometer scanning parameters of laser processing

      NameParameter
      Designed operation wavelength/nm515-540
      Effective focal length/mm104.7
      Working distance/mm138.5
      Maximum scan angle/(°)13.1
      Scan area/mm246×46
      Laser spot diameter/μm10
    • Table 3. Initial test result of ps laser marking on IR Corning glass

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      Table 3. Initial test result of ps laser marking on IR Corning glass

      No.Focus position/mmEye observationMicroscope observationRemarks
      12ClearClear-two marksUpper surface
      21.5ClearClear-two marks
      31ClearClear-two marks
      40.5ClearClear-two marks
      50.4ClearClear-two marks
      60.3ClearClear-two marks, nearly on the same plane
      70.2ClearClear-one mark
      80.1ClearClear-one mark
      90ClearClear-one markLower surface
      10−0.1ClearFaint-one mark
      11−0.2FaintFaint-one mark
      12−0.3InvisibleInvisible
    • Table 4. Result and strategy of marking on transparent sample

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      Table 4. Result and strategy of marking on transparent sample

      Laser powerFocus positionMarking characteristicGeometry deviationMarking effectEvaluation
      LargerClose to upper surfaceExtend from upper surface to lower surfaceLittleEtching too more, none geometry deviation×
      LargerMiddleExtend from middle to both upper and lower surfaceMediumEtching even more, have geometry deviation×
      LargerLower surfaceExtend from lower surface to upper surfaceLargeEtching too more, have geometry deviation×
      AppropriateClose to upper surfaceLess extend from upper surface to lower surfaceNoneEtching suitable, no geometry deviation
      AppropriateMiddleLess extend from middle to upper and lower surfaceMediumEtching suitable, have geometry deviation×
      AppropriateLower surfaceLess extend from lower surface to upper surfaceLargeEtching suitable, have geometry deviation×
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    Yinan Zhang, Wen Sun, Defeng Mo, Qinfei Xu, Xue Li. Laser marking process on transparent materials[J]. Infrared and Laser Engineering, 2022, 51(5): 20210416

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    Paper Information

    Category: Lasers & Laser optics

    Received: Jun. 21, 2021

    Accepted: --

    Published Online: Jun. 14, 2022

    The Author Email: Sun Wen (jacksunwen@mail.sitp.ac.cn)

    DOI:10.3788/IRLA20210416

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