Optics and Precision Engineering, Volume. 24, Issue 1, 39(2016)

Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs

QIU Yan-qing1,*... ZHANG Liu-liu1, CHEN Miao-gen1 and WANG Cheng-qun2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(17)

    [2] [2] YANG CH, JIN SH ZH, ZHAO M F, et al.. Research on LED performance of glass substrate with COB packaging. [J]. Laser & Optoelectronics Progress, 2015, 52(1): 203-207.(in Chinese)

    [3] [3] YU H, SHANG J, XU C, et al.. Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process (CFP)-made glass-bubble caps[C]. Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, 2011: 1-4.

    [4] [4] ZHAO G, SUN Q L, ZHAO Y, et al.. The characteristics and applications of the chip on board (COB) technology [J]. Electronic Outlook and Decision-making, 1995, 1: 29-31.(in Chinese)

    [6] [6] TANG K, ZHUO N Z, SHI F H, et al.. Research status and development trends of LED package [J]. China Illuminating Engineering Journal, 2014, 25(1): 26-30.(in Chinese)

    [7] [7] QI SH Q, DING SH D, ZHENG P, et al.. Research on the effects of COB encapsulation to LED optical property [J]. Electronics & Packaging, 2012, 3: 6-9.(in Chinese)

    [8] [8] WANG Y, LI G Q, LIU D W, et al.. Research on light properties of LED COB packaging products [J]. China Light & Lighting, 2013, 4: 10-12.(in Chinese)

    [10] [10] LU Y Y, LIU N T, HOU J K, et al.. Patent analysis about COB integrated packaging technology [J]. Information Research, 2012, 38(5): 11-15.(in Chinese)

    [12] [12] ZHONG G W. Technology research based on the SMT type LED components of COB encapsulation [J]. Telecom World, 2014 (4): 132-133.(in Chinese)

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    QIU Yan-qing, ZHANG Liu-liu, CHEN Miao-gen, WANG Cheng-qun. Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2016, 24(1): 39

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    Paper Information

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    Received: Aug. 14, 2015

    Accepted: --

    Published Online: Mar. 22, 2016

    The Author Email: Yan-qing QIU (qyqhz@cjlu.edu.cn)

    DOI:10.3788/ope.20162401.0039

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