Optics and Precision Engineering, Volume. 24, Issue 1, 39(2016)

Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs

QIU Yan-qing1,*... ZHANG Liu-liu1, CHEN Miao-gen1 and WANG Cheng-qun2 |Show fewer author(s)
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less

    According to the demands of Chip-on-board(COB) wafer level packing Light Emitting Diode(LED) powder complement and discharge equipment for the photoelectric parameter measurement, this paper develops a self-designed fast LED photoelectric parameter measurement system based on a fiber optic spectrometer. The system consists of an optical parameter detection module, a mechanical structure of LED measurement and a display module. The optical parameter detection module mainly consists of a homemade spectrometer for acquiring the spectral data to get the chromatic parameters of the LED. The mechanical structure of LED measurement consists of an integrating sphere and a test platform to be mounted different holders of COB packaging LED. It can measure the luminous flux, color coordinates and color temperatures fast. The designed LED photoelectric parameter measurement system is used to scan the COB packaging LED and measure photoelectric parameters, meanwhile the operator can repair powders based on actual measurement results. The results for the measurement of 10 LEDs show that the single measurement time is less than 3 s, the color coordinate accuracy and color coordinate repeatability are better than 0.003 and less than 0.000 5, respectively, and the color temperature precision and color temperature repeatability are 0.6%@5700K and less than 0.000 8, respectively. It satisfies the requirements of measurement system for the high-power COB packaging LED and is characterized by fast speeds, higher accuracy and higher repeatability.

    Tools

    Get Citation

    Copy Citation Text

    QIU Yan-qing, ZHANG Liu-liu, CHEN Miao-gen, WANG Cheng-qun. Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2016, 24(1): 39

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Aug. 14, 2015

    Accepted: --

    Published Online: Mar. 22, 2016

    The Author Email: Yan-qing QIU (qyqhz@cjlu.edu.cn)

    DOI:10.3788/ope.20162401.0039

    Topics