Fig. 1. Three packaging structures

Fig. 2. CS package structure

Fig. 3. Vacuum eutectic reflux curve

Fig. 4. SEM of AuSn solder at different bonding temperatures

Fig. 5. Wavelength change curve under different bonding pressure and temperature

Fig. 6. Curve of the relationship between different bonging times and device thermal resistance

Fig. 7. Photoelectric characteristic curve under different bonding pressure