Fig. 1. (Color online) DRIE process. (a) Foot effect on SOI. (b) DRIE on SOG.

Fig. 2. (Color online) The preparation of structures. (a) Etching with glue mask drilling. (b) ITO sputtering. (c) Lift off. (d) Anodic bonding. (e) DRIE. (f) Release.

Fig. 3. (Color online) The process of glass cover plate with filled vias. (a) Laser drilling. (b) Electroplating. (c) Active area etching.

Fig. 4. (Color online) Package with anodic bonding.

Fig. 5. (Color online) The etched silicon wafer on Glass

Fig. 6. (Color online) The etched structures. (a) ITO cut-off film. (b) The released and packaged structures.

Fig. 7. SEM results of the comb beams in SOG process.

Fig. 8. SEM results of the comb beams in SOI processs.

Fig. 9. The frequency domain response of a prepared accelerometer.