Acta Photonica Sinica, Volume. 51, Issue 2, 0251218(2022)
Effect of the Thickness of the a-Si Bonding Layer at InGaAs/Si Bonded Interface on the Performance of InGaAs/Si Avalanche Photodiode
Fig. 1. Device structure of bonded InGaAs/Si APD
Fig. 2. I-V curves of the APDs as a function of da
Fig. 3. Recombination rate of the APD as a function of da
Fig. 4. Carrier concentration and charge concentration as a function of da
Fig. 5. Energy band of the APD as a function of da
Fig. 6. Hole tunneling rate at bonded interface,impact ionization rate,and electrical field as a function of da
Fig. 7. Gain,3dB bandwidth,and carrier velocity as a function of da
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Shixian SHE, Ye ZHANG, Zhiwei HUANG, Jinrong ZHOU, Shaoying KE. Effect of the Thickness of the a-Si Bonding Layer at InGaAs/Si Bonded Interface on the Performance of InGaAs/Si Avalanche Photodiode[J]. Acta Photonica Sinica, 2022, 51(2): 0251218
Category: Special Issue for Ultrafast Optics
Received: Aug. 17, 2021
Accepted: Oct. 8, 2021
Published Online: May. 19, 2022
The Author Email: KE Shaoying (syke@mnnu.edu.cn)