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Infrared and Laser Engineering, Volume. 47, Issue 11, 1105002(2018)

Reliability of bonding interface in high power diode lasers

Peng Bo1,2, Zhang Pu1, Chen Tianqi1,2, Zhao Yincen2, Wu Dihai1,2, and Liu Hui1
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    Peng Bo, Zhang Pu, Chen Tianqi, Zhao Yincen, Wu Dihai, Liu Hui. Reliability of bonding interface in high power diode lasers[J]. Infrared and Laser Engineering, 2018, 47(11): 1105002

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    Paper Information

    Category: 激光器技术

    Received: Jun. 5, 2018

    Accepted: Jul. 3, 2018

    Published Online: Jan. 10, 2019

    The Author Email:

    DOI:10.3788/irla201847.1105002

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology