Microelectronics, Volume. 53, Issue 2, 355(2023)

Research on Bond Strength Decay of Wire Bonding Under Temperature Cycling

XIONG Huabing... LI Jinlong, HU Qiong, ZHAO Guanghui, ZHANG Wenfeng and TAN Kankan |Show fewer author(s)
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    References(8)

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    [2] [2] LIU P S, TONG L Y, WANG J L, et al. Challenges and developments of copper wire bonding technology [J]. Microelec Reliab, 2012, 52(6): 1092-1098.

    [4] [4] PARK J W, CHA H J, KIM B S, et al. Interfacial degradation mechanism of Au/Al and Alloy/Al bonds under high temperature storage test: contamination, epoxy molding compounds, wire and bonding strength [J]. IEEE Trans Compon Packag Technol, 2007, 30(4): 731-744.

    [5] [5] SUN L N, LIU Y T, LIU Y J, et al. Factors governing heat affected zone during wire bonding [J]. Trans Nonferrous Metals Society of China, 2009, 19(2): 490-494.

    [6] [6] OHNO Y, OHZEKI Y, ASO T, et al. Factors governing the loop profile in Au bonding wire [C] // IEEE Elec Compon & Technol Conf. San Diego, CA, USA. 1992: 899-902.

    [7] [7] YANG L, AGYAKWA P A, JOHNSON C M. A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects [J]. Microelec Reliab, 2011, 51(9-11): 1882-1886.

    [8] [8] YAMADA Y, TAKAKU Y, YAGI Y, et al. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device [J]. Microelec Reliab, 2007, 47(12): 2147-2151.

    [9] [9] HAMIDI A, BECK N, THOMAS K, et al. Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules [J]. Microelec Reliab, 1999, 39(6-7): 1153-1158.

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    XIONG Huabing, LI Jinlong, HU Qiong, ZHAO Guanghui, ZHANG Wenfeng, TAN Kankan. Research on Bond Strength Decay of Wire Bonding Under Temperature Cycling[J]. Microelectronics, 2023, 53(2): 355

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    Paper Information

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    Received: May. 20, 2022

    Accepted: --

    Published Online: Dec. 15, 2023

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.220187

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