Microelectronics, Volume. 53, Issue 2, 355(2023)
Research on Bond Strength Decay of Wire Bonding Under Temperature Cycling
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XIONG Huabing, LI Jinlong, HU Qiong, ZHAO Guanghui, ZHANG Wenfeng, TAN Kankan. Research on Bond Strength Decay of Wire Bonding Under Temperature Cycling[J]. Microelectronics, 2023, 53(2): 355
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Received: May. 20, 2022
Accepted: --
Published Online: Dec. 15, 2023
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