Optics and Precision Engineering, Volume. 31, Issue 13, 1890(2023)

Bump height measurement of chip packaging based on white light triangulation

Xianjin LIN... Zuwei WU, Ruiqian YE and Lei WANG* |Show fewer author(s)
Author Affiliations
  • School of Aerospace Engineering, Xiamen University, Xiamen361102, China
  • show less
    References(20)

    [2] H J KIM, D H YOON, H I KIM. 3D precision measurement of scanning moire using line scan camera. Hankook Kwanghak Hoeji, 19, 376-380(2008).

    [3] C J TAY. Measurement of a micro-solderball height using a laser projection method. Optics Communications, 234, 77-86(2004).

    [4] F C MENG, Z L ZHANG, Y H KANG et al. Height measurement of microbumps using a white-light triangulation method. Applied Optics, 61, 2036-2044(2022).

    [5] Z H HE, J SCHAEFER. High speed 3D inspection of advanced package interconnect uniformity, 1-6(2018).

    [6] [6] 6叶瑞乾, 郑鹏, 王磊, 等. 基于白光三角法的凸点封装高度测量仿真研究[J]. 光学与光电技术, 2022, 20(1): 43-49. doi: 10.3969/j.issn.1672-3392.2022.1.gxygdjs202201006YER Q, ZHENGP, WANGL, et al. Simulation research on height measurement of bump package based on white light triangulation method[J]. Optics & Optoelectronic Technology, 2022, 20(1): 43-49.(in Chinese). doi: 10.3969/j.issn.1672-3392.2022.1.gxygdjs202201006

    [7] R Q YE, P ZHENG, Y GAO et al. An intelligent error compensation method for height measurement of bump package, 74-78(2021).

    [8] M BEN-LEVI, I L HAIFA. System and method for height triangulation measurement.

    [9] B G JOO, T DONG CHO. 3D accuracy enhancement of BGA shiny round ball using optical triangulation method. Journal of the Korean Society for Precision Engineering, 32, 799-805(2015).

    [10] [10] 10王棚, 孟繁昌, 张滋黎, 等. 基于光学三角法的芯片凸点高度测量[J]. 光子学报, 2022, 51(5): 0512001.WANGP, MENGF CH, ZHANGZ L, et al. A bump height measurement method based on optical triangulation[J]. Acta Photonica Sinica, 2022, 51(5): 0512001.(in Chinese)

    [11] O RONNEBERGER, P FISCHER, T BROX. U-net Convolutional Networks for Biomedical Image Segmentation. Lecture Notes in Computer Science, 234-241(2015).

    [13] [13] 13冀振燕, 宋晓军, 付文杰, 等. 激光光条中心线提取研究综述[J]. 测控技术, 2021, 40: (6)1-8.JIZH Y, SONGX J, FUW J, et al. Review on centerline extraction for laser stripe[J]. Measurement & Control Technology, 2021, 40(6): 1-8. (in Chinese)

    [14] [14] 14张曦, 张健. 线结构光标定方法综述[J]. 激光与光电子学进展, 2018, 55(2): 020001. doi: 10.3788/LOP55.020001ZHANGX, ZHANGJ. Summary of line structure cursor calibration methods[J]. Laser & Optoelectronics Progress, 2018, 55(2): 020001.(in Chinese). doi: 10.3788/LOP55.020001

    [15] [15] 15邹媛媛, 赵明扬, 张雷. 基于量块的线结构光视觉传感器直接标定方法[J]. 中国激光, 2014, 41(11): 1108002.ZOUY Y, ZHAOM Y, ZHANGL. Direct calibration method of linear structured light vision sensor based on gauge block[J]. Chinese Journal of Lasers, 2014, 41(11): 1108002.(in Chinese)

    [16] [16] 16崔长彩, 杨成, 李子清, 等. 蓝宝石衬底表面形貌检测和评价系统[J]. 光学 精密工程, 2021, 29(11): 2556-2566. doi: 10.37188/OPE.20212911.2556CUICH C, YANGCH, LIZ Q, et al. Measuring and evaluating system for surface morphology of sapphire substrates[J]. Opt. Precision Eng., 2021, 29(11): 2556-2566. (in Chinese). doi: 10.37188/OPE.20212911.2556

    [17] N OTSU. A threshold selection method from gray-level histograms. IEEE Transactions on Systems, Man, and Cybernetics, 9, 62-66(1979).

    [18] [18] 18周渊, 孟祥群, 江登表, 等. 复杂干扰情况下的结构光条纹中心提取方法[J]. 中国激光, 2020, 47(12): 1204004. doi: 10.3788/cjl202047.1204004ZHOUY, MENGX Q, JIANGD B, et al. Extraction method of structured light stripe center under complex interference[J]. Chinese Journal of Lasers, 2020, 47(12): 1204004.(in Chinese). doi: 10.3788/cjl202047.1204004

    [19] [19] 19万卓仁, 赖磊捷. 基于自适应窗口的线结构光条中心提取方法[J]. 自动化仪表, 2020, 41(10): 43-46, 50.WANZH R, LAIL J. Method for extracting the center of line structured light stripe based on adaptive window[J]. Process Automation Instrumentation, 2020, 41(10): 43-46, 50. (in Chinese)

    [20] [20] 20孙传富, 彭涛, 陆永刚, 等. 连铸坯三维测量多线结构光的中心条纹快速提取[J]. 光学 精密工程, 2023, 31(3): 380-392. doi: 10.37188/OPE.20233103.0380SUNCH F, PENGT, LUY G, et al. Fast extraction center stripe of multi-line-structured light for three-dimensional measurement of casting slab[J]. Opt. Precision Eng., 2023, 31(3): 380-392. (in Chinese). doi: 10.37188/OPE.20233103.0380

    Tools

    Get Citation

    Copy Citation Text

    Xianjin LIN, Zuwei WU, Ruiqian YE, Lei WANG. Bump height measurement of chip packaging based on white light triangulation[J]. Optics and Precision Engineering, 2023, 31(13): 1890

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Modern Applied Optics

    Received: Nov. 2, 2022

    Accepted: --

    Published Online: Jul. 26, 2023

    The Author Email: WANG Lei (wanglei33@xmu.edu.cn)

    DOI:10.37188/OPE.20233113.1890

    Topics