Fig. 1. Schematic diagram of Bump measurement model

Fig. 2. Measurement system of chip package bump height based on white light triangulation

Fig. 3. Example of scanning process for chip samples

Fig. 4. Imaging effect under different exposure time

Fig. 5. Flow chart of bump height measurement algorithm

Fig. 6. Example of complex background of light stripe image （（a） （b） （c） （d）： there is no metal wiring on the bottom surface； （e） （f）： metal wiring on the bottom）

Fig. 7. U-Net model and optimized structural parameters

Fig. 8. Complete extraction process of light stripe center

Fig. 9. Relationship of grayscale area with distance between grayscale gravity and stripe center

Fig. 10. Regional repeatability distribution under non overexposure and overexposure

Fig. 11. Height measurement error of Bumps （overexposure）

Fig. 12. Bump with large measurement error （the second light spot）

Fig. 13. Examples of complex backgrounds for chip samples