To measure the bump height of chip packaging， a measurement system based on white-light triangulation was established， and a method for measuring the bump height in a complex background was proposed. First， the bump-height measurement system was built according to the proposed measurement model. Next， the U-Net deep learning model was used to segment the light stripe image， and the grayscale barycenter method and interpolation method were combined for extracting the complete light stripe center to overcome the interference of the complex background. Subsequently， the measurement system was calibrated to determine the corresponding relationship between the pixel value and the actual height value. Finally， the height of the bump was determined via function fitting. The experimental results indicate that the average repeatability of bump-height measurement is 0.21 μm， with a standard deviation of 0.095 μm； the average measurement error is ⁃0.04 μm， with a standard deviation is 0.408 μm. In this study， bump-height measurement with high accuracy and robustness in a complex background was realized， which can satisfy the requirements of online detection of wafer bump coplanarity in chip packaging.