Acta Optica Sinica, Volume. 42, Issue 17, 1713001(2022)

High-Performance Passive Silicon Photonic Waveguide Devices: Progress and Challenges

Dajian Liu, Weike Zhao, Long Zhang, Lijia Song, Jingshu Guo, Yiwei Xie, Huan Li, Zejie Yu, Liu Liu, Yaocheng Shi, and Daoxin Dai*
Author Affiliations
  • College of Optical Science and Engineering, Zhejiang University, Hangzhou 310058, Zhejiang, China
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    Due to its prominent advantages such as complementary metal oxide semiconductor (CMOS) compatibility and high integration, silicon photonics technology is recognized as the most promising new generation of mainstream photonic integration technologies and has thus attracted great attention worldwide. On the one hand, great progress has been made in the research field of passive/active silicon photonic devices and integrated circuits in recent years. Silicon photonics technology has ushered in a broader space for application owing to the rapid development of emerging fields, such as optical communication, optical interconnection, optical sensing, optical measurement, and optical computing. On the other hand, silicon photonic devices and circuits are also exposed to various challenges as they are desired to achieve better performance, higher density, and larger scale. This paper focuses on high-performance passive silicon photonic waveguide devices for wavelength division multiplexing, polarization multiplexing, mode multiplexing as well as hybrid multiplexing, particularly on their performance breakthrough and function expansion. Finally, the prospects of silicon photonic waveguide devices are discussed and presented.

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    Dajian Liu, Weike Zhao, Long Zhang, Lijia Song, Jingshu Guo, Yiwei Xie, Huan Li, Zejie Yu, Liu Liu, Yaocheng Shi, Daoxin Dai. High-Performance Passive Silicon Photonic Waveguide Devices: Progress and Challenges[J]. Acta Optica Sinica, 2022, 42(17): 1713001

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    Paper Information

    Category: Integrated Optics

    Received: Jul. 15, 2022

    Accepted: Aug. 8, 2022

    Published Online: Sep. 16, 2022

    The Author Email: Dai Daoxin (dxdai@zju.edu.cn)

    DOI:10.3788/AOS202242.1713001

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