Infrared and Laser Engineering, Volume. 45, Issue 12, 1204001(2016)
Study of the sub-surface damage of HgCdTe induced by chemical-mechanical polishing method
Study of the sub-surface damage induced by chemical-mechanical polishing method has been carried out for HgCdTe material. The optical characterization was performed for the surface after repeated step removal by wet etching using spectroscopic ellipsometry. It was found that the depth of sub-surface damage layer was about 15-20 times of the diameter of the abrasive particles. Through the comparison of the minority carrier lifetime and performance of the ultimate photoconductive detectors, it was considered that an obvious improvement could be achieved by a complete removal of this sub-surface damage layer.
Get Citation
Copy Citation Text
Qiao Hui, Chen Xintian, Zhao Shuiping, Lan Tianyi, Wang Nili, Zhu Longyuan, Li Xiangyang. Study of the sub-surface damage of HgCdTe induced by chemical-mechanical polishing method[J]. Infrared and Laser Engineering, 2016, 45(12): 1204001
Category: 红外技术及应用
Received: Apr. 17, 2016
Accepted: May. 20, 2016
Published Online: Jan. 12, 2017
The Author Email: Hui Qiao (qiaohui@mail.sitp.ac.cn)