[1] XIE X Z, ZHOU C X, WEI X, et al. Laser machining of transparent brittle materials: from machining strategies to applications[J]. Opto-Electronic Advances, 2, 180017(2019).

[2] WANG H J, YANG T. A review on laser drilling and cutting of silicon[J]. Journal of the European Ceramic Society, 41, 4997-5015(2021).

[3] XU J Y, HU H, ZHUANG C H, et al. Controllable laser thermal cleavage of sapphire wafers[J]. Optics and Lasers in Engineering, 102, 26-33(2018).

[4] LI Z Q, WANG X F, WANG J L, et al. Stealth dicing of sapphire sheets with low surface roughness, zero kerf width, debris/crack-free and zero taper using a femtosecond Bessel beam[J]. Optics & Laser Technology, 135, 106713(2021).

[5] LIAO Y, SHEN Y L, QIAO L L, et al. Femtosecond laser nanostructuring in porous glass with sub-50 nm feature sizes[J]. Optics Letters, 38, 187-189(2013).

[7] SAVRIAMA G, BAILLET F, BARREAU L, et al. Optimization of diode pumped solid state ultraviolet laser dicing of silicon carbide chips using design of experiment methodology[J]. Journal of Laser Applications, 27, 032009(2015).

[8] NAKAJIMA A, TATEISHI Y, MURAKAMI H, et al. High-speed dicing of SiC wafers by femtosecond pulsed laser[J]. Materials Science Forum, 821-823, 524-527(2015).

[9] KUMAGAI M, UCHIYAMA N, OHMURA E, et al. Advanced dicing technology for semiconductor wafer—stealth dicing[J]. IEEE Transactions on Semiconductor Manufacturing, 20, 259-265(2007).

[10] KIM E, SHIMOTSUMA Y, SAKAKURA M, et al. 4H-SiC wafer slicing by using femtosecond laser double-pulses[J]. Optical Materials Express, 7, 2450-2460(2017).

[11] ZHANG Z, WEN Z D, SHI H Y, et al. Dual laser beam asynchronous dicing of 4H-SiC wafer[J]. Micromachines, 12, 1331-1340(2021).

[12] OKADA T, TOMITA T, MATSUO S, et al. Formation of periodic strained layers associated with nanovoids inside a silicon carbide single crystal induced by femtosecond laser irradiation[J]. Journal of Applied Physics, 106, 054307(2009).

[13] TAYLOR R, HNATOVSKY C, SIMOVA E. Applications of femtosecond laser induced self-organized planar nanocracks inside fused silica glass[J]. Laser & Photonics Reviews, 2, 26-46(2008).

[14] STUART B C, FEIT M D, HERMAN S, et al. Nanosecond-to-femtosecond laser-induced breakdown in dielectrics[J]. Physical Review B, 53, 1749-1761(1996).

[15] OHMURA E, KUMAGAI M, NAKANO M, et al. Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer[J]. Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2, 540-549(2008).