Researching | Research on stealth dicing silicon carbide wafer by picosecond laser pulses

Optical Instruments, Volume. 44, Issue 3, 88(2022)

Research on stealth dicing silicon carbide wafer by picosecond laser pulses

Yanguo SONG, Xu GUO, Yanluan WANG, and Qiang HAO^*

Author Affiliations

School of Optical Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China

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References (14)

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Figures & Tables(7)

Fig. 1. Experimental setup

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Fig. 2. Laser parameters

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Fig. 3. Cutting results of Laser1

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Fig. 4. Cutting results of Laser2

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Fig. 5. Wafer surface results of 25 μm focal depth laser

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Fig. 6. Wafer surface results of 20 μJ single-pulse-laser was focused at different depths

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Fig. 7. Cross-section of the slice

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Yanguo SONG, Xu GUO, Yanluan WANG, Qiang HAO. Research on stealth dicing silicon carbide wafer by picosecond laser pulses[J]. Optical Instruments, 2022, 44(3): 88

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Paper Information

Category: INSTRUMENTS

Received: Feb. 15, 2022

Accepted: Mar. 20, 2022

Published Online: Jul. 8, 2022

The Author Email: HAO Qiang (qianghao@usst.edu.cn)

DOI:10.3969/j.issn.1005-5630.2022.03.013

Topics

laser devices and laser physics

Lasers and Laser Optics

laser manufacturing

Instrumentation, Measurement and Metrology