Semiconductor Optoelectronics, Volume. 45, Issue 3, 508(2024)
Pavement Crack Feature Extraction Based on Image Processing
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DAI Shaosheng, MAO Xinghua, YU Zian. Pavement Crack Feature Extraction Based on Image Processing[J]. Semiconductor Optoelectronics, 2024, 45(3): 508
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Received: Jan. 3, 2024
Accepted: --
Published Online: Oct. 15, 2024
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