Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Semiconductor Optoelectronics, Volume. 45, Issue 3, 508(2024)

Pavement Crack Feature Extraction Based on Image Processing

DAI Shaosheng1... MAO Xinghua1 and YU Zian2 |Show fewer author(s)
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
    • show less
    AbstractGet PDF(in Chinese)
    Figures&Tables (0)
    Equations (0)
    References (8)
    Tools
    Paper Information
    Topics
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    DAI Shaosheng, MAO Xinghua, YU Zian. Pavement Crack Feature Extraction Based on Image Processing[J]. Semiconductor Optoelectronics, 2024, 45(3): 508

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category:

    Received: Jan. 3, 2024

    Accepted: --

    Published Online: Oct. 15, 2024

    The Author Email:

    DOI:10.16818/j.issn1001-5868.2024010304

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology