Microelectronics, Volume. 54, Issue 2, 311(2024)

Thermal Fatigue Failure Analysis and Structural Optimization of LCCC Packaged Devices

LIU Min... CHEN Yilong, LI Kui, LI Yuan and ZENG Jingwen |Show fewer author(s)
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    References(2)

    [7] [7] CHEN Y L, LI F, LI K, et al. Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints [J]. Microelectronics and Reliability,2022, 132(5): 114532.1-114532.12

    [9] [9] XIA G F, QIN F, GAO C, et al. Reliability design of multirow quad flat nonlead packages based on numerical design of experiment method [J]. Journal of Electronic Packaging, 2013, 135 (4): 041007.1-041007.6.

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    LIU Min, CHEN Yilong, LI Kui, LI Yuan, ZENG Jingwen. Thermal Fatigue Failure Analysis and Structural Optimization of LCCC Packaged Devices[J]. Microelectronics, 2024, 54(2): 311

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    Paper Information

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    Received: Aug. 18, 2023

    Accepted: --

    Published Online: Aug. 21, 2024

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.230318

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