Microelectronics, Volume. 54, Issue 2, 311(2024)
Thermal Fatigue Failure Analysis and Structural Optimization of LCCC Packaged Devices
References(2)
[7] [7] CHEN Y L, LI F, LI K, et al. Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints [J]. Microelectronics and Reliability,2022, 132(5): 114532.1-114532.12
[9] [9] XIA G F, QIN F, GAO C, et al. Reliability design of multirow quad flat nonlead packages based on numerical design of experiment method [J]. Journal of Electronic Packaging, 2013, 135 (4): 041007.1-041007.6.
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LIU Min, CHEN Yilong, LI Kui, LI Yuan, ZENG Jingwen. Thermal Fatigue Failure Analysis and Structural Optimization of LCCC Packaged Devices[J]. Microelectronics, 2024, 54(2): 311
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Received: Aug. 18, 2023
Accepted: --
Published Online: Aug. 21, 2024
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