Microelectronics, Volume. 54, Issue 2, 311(2024)
Thermal Fatigue Failure Analysis and Structural Optimization of LCCC Packaged Devices
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LIU Min, CHEN Yilong, LI Kui, LI Yuan, ZENG Jingwen. Thermal Fatigue Failure Analysis and Structural Optimization of LCCC Packaged Devices[J]. Microelectronics, 2024, 54(2): 311
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Received: Aug. 18, 2023
Accepted: --
Published Online: Aug. 21, 2024
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