Contact
type
| Scanning probe surface profilometer;
Atomic force microscope
| Up to pm level vertical resolution | Slow speed, not suitable for large diameter components | 3D |
Non contact
type
| Interference method | Laser/White light interferometer | Vertical resolution up to 0.1 nm | Complex fringe demodulation
and low lateral resolution
| 3D |
Differential interference difference | High resolution | Complex technical design | 3D |
Optical coherence chromatography | Good depth resolution | Low horizontal resolution | 3D |
Diffraction method | Simultaneously detect the
defect type and size
| Not universal | 2D |
Scattering
method
| Visual method | Simple and fast operation | Low accuracy and great
subjective influence
| 2D |
Virtual image superposition comparison method | Higher accuracy than
visual method
| Great subjective influence | 2D |
Filtering imaging
detection method
| Fast | Low resolution | 2D |
Infrared detection method | Easy | Low accuracy, affected
by environment
| 1D |
Dark field scattering imaging | The results are intuitive and
have good contrast
| It needs splicing detection
and takes a long time
| 2D |
Bright field scattering imaging | The results are intuitive and
the resolution is high
| Slow | 2D |
Non contact
type
| Scattering
method
| Laser scattering confocal microscopy | Clear imaging and high
system resolution
| Complex device and
low efficiency
| 3D |
Photothermal deflection
microscopy
| High accuracy | Low efficiency | 3D |
Total internal reflection method | The obtained dark field image
is easy to process
| Small imaging space angle | 3D |
Fringe reflection method | Simple device and high
sensitivity
| Suitable for small area measurement | 3D |
Scattered light energy
analysis method
| The scattering characteristics of defects are obtained accurately | The location and number
of defects cannot be
accurately obtained.
| 2D |
Laser spectrum analysis | The device is simple and
easy to operate
| Disturbed by defective
deep structure
| 2D |