Fig. 1. Schematic of film thickness deposited by twin target magnetron sputtering

Fig. 2. Horizontal uniformity distribution curves of film thickness of different materials. (a) Si₃N₄; (b) SiO₂

Fig. 3. Corresponding relationship between target magnetic field uniformity and film thickness uniformity under different materials. (a) Si₃N₄; (b) SiO₂

Fig. 4. Influence curves of target base distance of different materials on refractive index. (a) SiO₂; (b) Si₃N₄

Fig. 5. Relationship between plasma density and film thickness of different materials. (a) Si₃N₄; (b) SiO₂

Fig. 6. Uniformity distribution of transverse and longitudinal film thickness

Fig. 8. Longitudinal uniformity curves of film thickness of different materials. (a) Si₃N₄; (b) SiO₂

Fig. 9. Influence curves of film thickness homogeneity under different conditions. (a) Amplitude; (b) phase

Fig. 10. Voltage change curve of target material after loading sinusoidal half wave voltage

Fig. 11. Transverse distribution curves of Si₃N₄ monolayer film spectrum. (a) Top; (b) middle; (c) bottom

Fig. 12. Transverse distribution curves of SiO₂ monolayer film spectrum. (a) Top; (b) middle; (c) bottom

Fig. 13. Spectral distribution curves of hard antireflection film in different directions. (a) Transversal; (b) longitudinal