Optics and Precision Engineering, Volume. 16, Issue 9, 1701(2008)

Research on copper gap-filling in micro electroplating process with N'N-diethylthiourea

ZHANG Tao1,*... WU Yi-hui2, YANG Jian-cheng1, ZHANG Ping2 and LIU Yong-shun2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(3)

    [1] [1] YAO F,EROL C H,MURALIDHAR K.Fabrication of microstructures with different aspect rations in a single layer[J].SPIE,2005,5650:156-162

    [2] [2] ZHANG Y H,DING G F,CAI Y L,et al..Electroplating of low stress permalloy for MEMS[J].Materials Characterization,2006,1(6):1-5

    [9] [9] BRAUN A E.Copper electroplating enters mainstream processing[J].Semiconductor International,1999,22(4):58-66

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    ZHANG Tao, WU Yi-hui, YANG Jian-cheng, ZHANG Ping, LIU Yong-shun. Research on copper gap-filling in micro electroplating process with N'N-diethylthiourea[J]. Optics and Precision Engineering, 2008, 16(9): 1701

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    Paper Information

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    Received: Feb. 18, 2008

    Accepted: --

    Published Online: Feb. 28, 2010

    The Author Email: Tao ZHANG (zqs_0431@126.com)

    DOI:

    CSTR:32186.14.

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