Optics and Precision Engineering, Volume. 16, Issue 9, 1701(2008)
Research on copper gap-filling in micro electroplating process with N'N-diethylthiourea
[1] [1] YAO F,EROL C H,MURALIDHAR K.Fabrication of microstructures with different aspect rations in a single layer[J].SPIE,2005,5650:156-162
[2] [2] ZHANG Y H,DING G F,CAI Y L,et al..Electroplating of low stress permalloy for MEMS[J].Materials Characterization,2006,1(6):1-5
[9] [9] BRAUN A E.Copper electroplating enters mainstream processing[J].Semiconductor International,1999,22(4):58-66
Get Citation
Copy Citation Text
ZHANG Tao, WU Yi-hui, YANG Jian-cheng, ZHANG Ping, LIU Yong-shun. Research on copper gap-filling in micro electroplating process with N'N-diethylthiourea[J]. Optics and Precision Engineering, 2008, 16(9): 1701
Category:
Received: Feb. 18, 2008
Accepted: --
Published Online: Feb. 28, 2010
The Author Email: Tao ZHANG (zqs_0431@126.com)
CSTR:32186.14.