[1] Dongbing He, Lili Hu, Shubin Chen, et al. Rare earth ions doped optical functional glass and application (Invited). Infrared and Laser Engineering, 49, 20201081(2020).

[2] Jiawei Qiu, Zhen Zhang, Saifen Yu, et al. Development of 1.5 μm lidar for atmospheric detection (Invited). Infrared and Laser Engineering, 50, 20210079(2021).

[3] Jian Zhang, Lei Zhang, Fei Zeng, et al. Development status of airborne 3 D imaging lidar systems. Chinese Journal of Optics, 4, 213-232(2011).

[4] Yulu Zhang, Yongling Hui, Menghua Jiang, et al. Experimental study of LD-pumped erbium ytterbium co-doped phosphate glass passively Q-switched microlaser. Infrared and Laser Engineering, 47, 0305004(2017).

[5] Yufeng Yan, Yang Yu, Suping Bai, et al. Progress on beam quality control technology of slab lasers. Chinese Journal of Optics, 12, 767-782(2019).

[6] C Brown, C L Bonner, T J Warburton, et al. Thermally bonded planar waveguide lasers. Applied Physics Letters, 71, 1139-1141(1997).

[7] Juntao Wang, Dan Wang, Hua Su, et al. Influence factors on efficiency of Nd: YAG planar waveguide laser amplifier. Chinese Journal of Lasers, 44, 45-50(2017).

[8] G Kalkowski, S Risse, U Zeitner, et al. (Invited) glass-glass direct bonding. ECS Transactions, 64, 3-11(2014).

[9] Mengsheng Yang, Pifeng Xing, Chengfu Wei, . et al. Precision diffusion bonding of iron-aluminum impedance match target. Optics and Precision Engineering, 24, 2738-2745(2016).

[10] [10] Xing Xiaowen. Research on miniaturized high energy Er3+Yb3+ codoped phosphate glass planar waveguide amplifier [D]. Beijing: Beijing University of Technology, 2020. (in Chinese)

[11] T Sakimura, K Hirosawa, Y Watanabe, et al. 1.55-mum high-peak, high-average-power laser amplifier using an Er, Yb: Glass planar waveguide for wind sensing coherent Doppler lidar. Optics Express, 27, 24175-24187(2019).

[12] [12] Hu Lili. Laser Glass its Applications [M]. Shanghai: Shanghai Science Technology Press, 2019. (in Chinese)

[13] Mengxia Liu, Qiang Qin, Xianshan Dong, et al. Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process. Optics and Precision Engineering, 28, 1715-1724(2020).

[14] M H Roh, H Nishikawa, S Tsutsumi, et al. Pressureless bonding by micro-sized silver particle paste for high-temperature electronic packaging. Materials Transactions, 57, 1209-1214(2016).

[15] Zhaohui Han, Shenggang Zhou, Peixian Zhu, et al. Electronic structure of phase interface diffusion reaction layer of Ti-Al laminar composites. Acta Materiae Compositae Sinica, 31, 1350-1356(2014).

[16] [16] Pan Qunxiong, Wang Luming, Cai Anlan. Fundamentals of Inganic Materials Science[M]. Beijing: Chemical Industry Press, 2017. (in Chinese)