Infrared and Laser Engineering, Volume. 51, Issue 12, 20220239(2022)

Thermal bonding preparation and interfacial diffusion research of glass planar waveguides

Chunrui Zhang1,2, Shunguang Li1, Lili Hu1, and Dongbing He1
Author Affiliations
  • 1Key Laboratory of Materials for High Power Laser, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China
  • 2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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    Figures & Tables(11)
    Schematic illustrations of the planar waveguide fabrication process
    Bonding process
    Effective bonding area under different bonding curves and different bonding temperatures (Tb)
    Distance-Yb3+ signal intensity diagram at different bonding temperatures
    Distance-Yb3+ signal intensity diagram at different bonding time
    Diagram of diffision model
    Fitting curves at different bonding temperatures
    Fitting curves at different bonding time
    Thickness of diffusion reaction layer at different bond
    • Table 1. K and D at different temperatures

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      Table 1. K and D at different temperatures

      Tempreture530 ℃550 ℃570 ℃590 ℃
      K1.83381.67771.42081.2265
      D3.717×1034.441×1036.192×1038.309×103
    • Table 2. K and D at different time

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      Table 2. K and D at different time

      Time20 h30 h60 h
      D4.441×1034.441×1034.441×103
      K1.67771.36980.9686
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    Chunrui Zhang, Shunguang Li, Lili Hu, Dongbing He. Thermal bonding preparation and interfacial diffusion research of glass planar waveguides[J]. Infrared and Laser Engineering, 2022, 51(12): 20220239

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    Paper Information

    Category: Materials & Thin films

    Received: Apr. 7, 2022

    Accepted: May. 16, 2022

    Published Online: Jan. 10, 2023

    The Author Email:

    DOI:10.3788/IRLA20220239

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