Infrared and Laser Engineering, Volume. 51, Issue 12, 20220239(2022)
Thermal bonding preparation and interfacial diffusion research of glass planar waveguides
Figures & Tables(11)
Fig. 1. Schematic illustrations of the planar waveguide fabrication process
Fig. 3. Effective bonding area under different bonding curves and different bonding temperatures (
Fig. 4. Distance-Yb3+ signal intensity diagram at different bonding temperatures
Fig. 5. Distance-Yb3+ signal intensity diagram at different bonding time
Table 1.
K andD at different temperaturesView tableView in ArticleTable 1.
K andD at different temperaturesTempreture 530 ℃ 550 ℃ 570 ℃ 590 ℃ K 1.8338 1.6777 1.4208 1.2265 D 3.717×103 4.441×103 6.192×103 8.309×103
Table 2.
K andD at different timeView tableView in ArticleTable 2.
K andD at different timeTime 20 h 30 h 60 h D 4.441×103 4.441×103 4.441×103 K 1.6777 1.3698 0.9686
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Chunrui Zhang, Shunguang Li, Lili Hu, Dongbing He. Thermal bonding preparation and interfacial diffusion research of glass planar waveguides[J]. Infrared and Laser Engineering, 2022, 51(12): 20220239
Paper Information
Category: Materials & Thin films
Received: Apr. 7, 2022
Accepted: May. 16, 2022
Published Online: Jan. 10, 2023
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