Infrared and Laser Engineering, Volume. 51, Issue 12, 20220239(2022)

Thermal bonding preparation and interfacial diffusion research of glass planar waveguides

Chunrui Zhang1,2, Shunguang Li1, Lili Hu1, and Dongbing He1
Author Affiliations
  • 1Key Laboratory of Materials for High Power Laser, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China
  • 2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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    Erbium-ytterbium co-doped phosphate glass planar waveguides have unique advantages in heat dissipation and nonlinear effect suppression. It can be developed as the gain medium of near-infrared 1.5 μm high average power solid lasers, which is of great significance. Erbium-ytterbium co-doped phosphate glass planar waveguides are fabricated by optical contacting and thermal bonding. The effect of pre-bonding step-temperature on bonding quality is studied. At the same time, the influence of bonding temperature and bonding time on the thickness of molecular diffusion layer at bonding interface is obtained by electron probe surface analysis (EPMA). According to Fick's second law, the diffusion mechanism of Yb3+ in core glass under one-dimensional equivalence hypothesis is discussed, and the molecular diffusion model of the solid-solid interface during bonding process is established. Finally, a high-quality sandwich structure planar waveguide with 100 μm core layer and bonding strength of 11.63 MPa is obtained by selecting optimal heat treatment temperature curve.

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    Chunrui Zhang, Shunguang Li, Lili Hu, Dongbing He. Thermal bonding preparation and interfacial diffusion research of glass planar waveguides[J]. Infrared and Laser Engineering, 2022, 51(12): 20220239

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    Paper Information

    Category: Materials & Thin films

    Received: Apr. 7, 2022

    Accepted: May. 16, 2022

    Published Online: Jan. 10, 2023

    The Author Email:

    DOI:10.3788/IRLA20220239

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