Microelectronics, Volume. 54, Issue 2, 298(2024)
High-Frequency Characteristic Analysis and Optimization of 3D-Packaging Through Glass Via
References(1)
[6] [6] YANG L, ZHANG M Z, LIU X X, et al.Electromagnetic modeling and analysis of the tapered differential through glass vias [J]. Microelectronics Journal, 2018, 83: 27-31.
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HUANG Genxin, HUANG Chunyue, LI Peng, TAN Lijuan. High-Frequency Characteristic Analysis and Optimization of 3D-Packaging Through Glass Via[J]. Microelectronics, 2024, 54(2): 298
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Received: Jul. 17, 2022
Accepted: --
Published Online: Aug. 21, 2024
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