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Microelectronics, Volume. 54, Issue 2, 298(2024)

High-Frequency Characteristic Analysis and Optimization of 3D-Packaging Through Glass Via

HUANG Genxin1... HUANG Chunyue2, LI Peng1 and TAN Lijuan3 |Show fewer author(s)
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  • 1[in Chinese]
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  • 3[in Chinese]
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    HUANG Genxin, HUANG Chunyue, LI Peng, TAN Lijuan. High-Frequency Characteristic Analysis and Optimization of 3D-Packaging Through Glass Via[J]. Microelectronics, 2024, 54(2): 298

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    Received: Jul. 17, 2022

    Accepted: --

    Published Online: Aug. 21, 2024

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.220271

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology